Asahi Diamond Industrial Co., Ltd. will be exhibiting at SEMICON Japan 2022
We will exhibit our diamond and CBN tools for highly efficient machining of electronic components and semiconductors.
We would like to take this opportunity to invite you to visit our booth and have a look at our products.
We look forward to seeing you at our booth.
Dates: Wednesday, December 14 - Friday, December 16, 2022: 3 days
Opening hours: 10:00-17:00
Venue: Tokyo Big Sight (Tokyo International Exhibition Center)
East Exhibition Hall, Booth No. 1640 (Hall 1)
Official website https://www.semiconjapan.org/jp
Products on Display
Electroplated diamond wire for ingot slicing "EcoMEP®"
Chamfering wheels for peripheral/notch grinding wheel
Grinding Wheel for Wafer Surface
CMP conditioners "NEOgO®"
Dicing blades/cutters "MERIUS METAL®"
Dressing boards "PRIDUSBOARD®"
Other electronic semiconductor related tools