SEMICON Diamond SEMICON will be exhibiting at the SEMICON Japan 2022 trade show
We will be showcasing high-efficiency diamond and CBN tools for the electronic components and semiconductor industries.
We cordially invite you to take this opportunity to visit our booth and view our products.
We sincerely look forward to seeing you there.
Dates: December 14 (Wed) – 16 (Fri), 2022: 3 days
Hours: 10:00 a.m. – 5:00 p.m.
Venue: Tokyo Big Sight (Tokyo International Exhibition Center)
East Exhibition Hall, Booth No. 1640 (Hall 1)
Official Website: https://www.semiconjapan.org/jp
Products on Display
Electroplated diamond wire for ingot slicing "EcoMEP®"
Chamfering wheels for peripheral/notch grinding wheel
Grinding Wheel for Wafer Surface
CMP conditioners "NEOgO®"
Dicing blades/cutters "MERIUS METAL®"
Dressing boards "PRIDUSBOARD®"
Other electronic semiconductor related tools